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High thermal conductivity package
lengthy development cycles
3V I/O operation- Built-in ChipSync™ source-synchronous technology- Digitally controlled impedance (DCI) active termination- Fine grained I/O banking (configuration in one bank)• Flexible Logic Resources• Secure Chip AES Bitstream Encryption• 90 nm Copper CMOS Process• 1
25V ±3% • VPP = 1
Xilinx Field Programmable Gate Array - FPGA - part # XC4VLX40-10FFG1148C CMOS Image Sensor High thermal conductivity packageThe Xilinx FPGA #XC4VLX40 10FFG1148C combines Advanced Silicon Modular Block (ASMBL) architecture with a wide variety of flexible features, the Virtex 4 family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC technology. Virtex 4 FPGAs comprise three platform familiesLX, FX, and SXoffering multiple feature choices and combinations to address all complex applications. The wide array of Virtex
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