IC Chip BGA Reballing Stencil Kits Set Solder Template for Samsung S8 mechanic tip The size of each grid

Name: IC Chip BGA Reballing Stencil Kits Set Solder Template for Samsung S8 mechanic tip The size of each grid
Brand: acquienergia.it
SKU: 98612406350
Price: 343.00 USD
Availability: InStock
Rating: 4.1044 (12 reviews)

SKU: 98612406350

4.1

USD343.00 USD364.00

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Ships within 48 hours · Estimated delivery Jul 29 - Aug 3

Description

The size of each grid can be adjusted by removing the PP sheet at the bottom layer

Voltage: 24V

laboratory source has a continuously variable voltage of 0-30V with a maximum current of 3A

Host device: 72*35*145mm

IC Chip BGA Reballing Stencil Kits Set Solder Template for Samsung S8 mechanic tip The size of each grid1. spare parts for Samsung 2. 100% new and original

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